Pin row connector 2.54 spacing 2 * 40p round hole row pin HY-RM25H30DD40 Pin row connector 2.54 spacing 2 * 40p round hole row pin HY-RM25H30DD40

2.0 spacing single row needle 1 * 40pin needle holder HY-M20D40P. Row pin, a kind of connector. This kind of connector is widely used in PCB circuit board of electronics, electrical appliances and instruments. Its function is to play a bridge function between the blocked or isolated circuits in the circuit, and undertake the task of current or signal transmission.

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  • Product Description
  • Specifications
  • Certificates

Features:

100% brand new and high quality.

Easy to install and use.

Easy structure, mini body,

Row pin, a kind of connector. This kind of connector is widely used in PCB circuit board of electronics, electrical appliances and instruments. Its function is to play a bridge function between the blocked or isolated circuits in the circuit, and undertake the task of current or signal transmission.

Busbar, a kind of connector. It is a universal connecting device widely used in electronics, electrical appliances and instruments, which mainly plays the role of current or signal transmission. It is usually used together with a row of needles to form a plate-to-plate connection.

 

Specifications:

Product Name : CONNECTOR

Model:HY-RM25H30DD40


PIN  HEADER  SPECIFICATIONS


RATING CURRENT AND RATING VOLTAGE 
Rating current is (3.0)A, rating voltage is (1000)V DC/AC RMS.
(2.0)A,(1000)V DC/AC RMS. 


STORAGE AND OPERATING TEMPERATURE 
Temperature range:-(40)℃~+(105)℃,including terminal temperature rise for rating current.


Soldering
To avoid the secondary tin-melting,the temperature on PCB upper surface is 160℃ Max.for products
with lead,or200℃ Max.for lead-free products. The temperature of the PCB bottom surface shall not
be exceed 100℃ more than the temperature of the PCB upper surface. The peak temperature is
during 230~255℃ for products with lead, or 255~270℃ forlead-free products.The tin dip time is

duration for 3~10 seconds.


Solder-ability

Appearance of the specimen shall be inspected after the test with the assistance of a magnification
of 10 X for any damage such as pinholes,void or rough surface.

Soldering time:4 to 6 seconds.

Temperature:260±5℃


Packaging, storage and transportation requirements

1) The packaging of materials has a certain protective and sealing effect on the materials to ensure that the materials will not be damaged in the process of transportation.

2) The packing box shall meet the requirements of moisture-proof, vibration proof, pressure proof and mould proof.

3) The identification of the smallest packaging unit must include the trademark of the manufacturer, product model, name, material code and quantity.

4) The packaged products should be at ambient temperature of - 10 ℃~ + 40 ℃ and relative humidity below 80%. There is no acid, alkaline or other corrosive gas in the surrounding air

Under the above conditions, the materials can be stored for half a year from the date of production, and they are still qualified products within half a year.



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