USB is a standard and single interface for connecting computer peripheral devices.
1.1: Housing: Minimum UL 94-V0 rated, thirty percent (30%) glass-filled polybutylene terephthalate (PBT) or better. Thermal capability: SMT TYPE >26℃; DIP TYPE >205℃; solder TYPE > 350℃ of 5s
1.2: Shell: Substrate Material: 0.30 + 0.05 mm iron, nickel silver, or other copper based high strength materials. Plating: Outside: Optional. Minimum 2.00 micrometers (80 microinches) nickel. In addition,manufacturer may use a copper underplate beneath the nickel.
1.3: Terminal: Substrate Material: 0.25 + 0.05 mm minimum half-hard phosphor bronze or other high strength copper based material; Plating:
1.3.1.Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material is optional.
1.3.2. Mating Area: Minimum 0.75 micrometers (30 microinches) gold.
1.3.3. Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin over the underplate.
2. Electrical Characteristics
2.1: All electrical characteristics must be measured at or referenced to +20℃ (68 oF).
2.2: Voltage Rating: 30 V rms maximum.
2.3: Contact Current Rating: 1.5 A at 250 V AC minimum. when measured at an ambient temperature of 25 °C. With power applied to the contacts, the T must not exceed +30 °C at any point in the USB connector under test.
3. Temperature Range:
A. Operating Temperature Range: 0℃ to +50℃
B. Storage Temperature Range: -20℃ to +60℃
C. Nominal Temperature Rating: +20℃